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Showing 49-72 of 181 item(s)

Lutowanie i Reballing

Sieve For BGA LCD Touch Controller Chips iPhone 6S-15 LCD3 V3.0

2591414

zł33.00

Sieve For BGA LCD Touch Controller Chips iPhone 6S-15 LCD3 V3.0.

Repair accessories

Low Temperature Solder Paste (158°C) 35g Mijing 158A

2591151

zł32.00

Low Temperature Solder Paste (158°C) 35g Mijing 158A.

Lutowanie i Reballing

Medium-Temperature Solder Paste (190°C) 35g Mijing 190A

2591104

zł32.00

Medium-Temperature Solder Paste (190°C) 35g Mijing 190A.

Lutowanie i Reballing

iPhone X/8/8P/SE2020 Big Audio IC- U4700 - 338S00248

245563

zł32.00

iPhone X/8/8P/SE2020 Big Audio IC- U4700 - 338S00248.

Home

iPhone X/8/8P/SE2020 Transceiver RF - PMB5757

Inna

245574

zł32.00

iPhone X/8/8P/SE2020 Transceiver RF - PMB5757.

Lutowanie i Reballing

iPhone X/8/8P/SE2020 Power IC - PMD9655 - BBPMU

245562

zł32.00

iPhone X/8/8P/SE2020 Power IC - PMD9655 - BBPMU.

Low-Temperature Solder Paste (138°C) 35g Mijing 138A.

Lutowanie i Reballing

Low-Temperature Solder Paste (138°C) 35g Mijing 138A.

2591103

zł32.00

Low-Temperature Solder Paste (138°C) 35g Mijing 138A.

Medium Temperature Solder Paste (189 ° C) 35g Mijing 189A.

Lutowanie i Reballing

Medium Temperature Solder Paste (189 ° C) 35g Mijing 189A.

2591104

zł32.00

Medium Temperature Solder Paste (189 ° C) 35g Mijing 189A..

Lutowanie i Reballing

copy of Sieve for BGA Amaoe Samsung A10-A70 Sam:14

2591385

zł35.00

Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).

Lutowanie i Reballing

copy of Sieve for BGA Amaoe Samsung A10-A70 Sam:14

2591384

zł35.00

Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).

Lutowanie i Reballing

copy of Sieve for BGA Amaoe Samsung A10-A70 Sam:14

2591383

zł35.00

Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).

Lutowanie i Reballing

copy of BGA Reballing Stencil Amaoe iPhone 15 - A17 T:0.12mm

2591352

zł35.00

BGA Reballing Stencil Amaoe iPhone 15 series - A17 T:0.12mm

Lutowanie i Reballing

BGA Reballing Stencil Amaoe iPhone 15 - A17 T:0.12mm

2591353

zł35.00

BGA Reballing Stencil Amaoe iPhone 15 series - A17 T:0.12mm

Lutowanie i Reballing

copy of Sieve for BGA Amaoe Samsung A10-A70 Sam:14

2591351

zł35.00

Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).

Lutowanie i Reballing

copy of Sieve for BGA Amaoe Samsung A10-A70 Sam:14

2591350

zł35.00

Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).

Lutowanie i Reballing

copy of Sieve for BGA Amaoe Samsung A10-A70 Sam:14

2591323

zł35.00

Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).

Lutowanie i Reballing

copy of Sieve for BGA Amaoe Samsung A10-A70 Sam:14

2591322

zł35.00

Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).

Lutowanie i Reballing

copy of Sieve for BGA Amaoe Samsung A10-A70 Sam:14

2591321

zł35.00

Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).

Lutowanie i Reballing

copy of Sieve for BGA Amaoe Samsung A10-A70 Sam:14

2591320

zł35.00

Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).

Lutowanie i Reballing

copy of Sieve for BGA Amaoe Samsung A10-A70 Sam:14

2591319

zł35.00

Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).

Lutowanie i Reballing

copy of Sieve for BGA Amaoe Samsung A10-A70 Sam:14

2591318

zł35.00

Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).

Lutowanie i Reballing

copy of Sieve for BGA Amaoe Samsung A10-A70 Sam:14

2591317

zł35.00

Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).

Lutowanie i Reballing

Sieve for BGA Amaoe Samsung A10-A70 Sam:14

2400004

zł35.00

Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).

Lutowanie i Reballing

Mijing Soldering Braid 2mm (5 psc)

zł36.00

Braid specifications: Specially adapted flux formula. Tin absorption capacity increased by 60%. Antioxidant formula. No residue, easy to clean. Model 2020: Length: 2.0 m, Width: 2.0 mm. Model 2015: Length: 1.5 m, Width: 2.0 mm.

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