Pastes

Showing 1-6 of 6 item(s)

Low Temperature Solder...

Repair accessories

Low Temperature Solder Paste (158°C) 35g Mijing 158A

zł32.00

Low Temperature Solder Paste (158°C) 35g Mijing 158A.

Medium-Temperature Solder...

Medium-Temperature Solder... 2

Lutowanie i Reballing

Medium-Temperature Solder Paste (190°C) 35g Mijing 190A

zł32.00

Medium-Temperature Solder Paste (190°C) 35g Mijing 190A.

Low-Temperature Solder Paste (138°C) 35g Mijing 138A.

Low-Temperature Solder Paste (138°C) 35g Mijing 138A. 2

Lutowanie i Reballing

Low-Temperature Solder Paste (138°C) 35g Mijing 138A.

zł32.00

Low-Temperature Solder Paste (138°C) 35g Mijing 138A.

Medium Temperature Solder Paste (189 ° C) 35g Mijing 189A.

Medium Temperature Solder Paste (189 ° C) 35g Mijing 189A. 2

Lutowanie i Reballing

Medium Temperature Solder Paste (189 ° C) 35g Mijing 189A.

zł32.00

Medium Temperature Solder Paste (189 ° C) 35g Mijing 189A..

High Temperature Solder Paste (217 ° C) 35g Mijing 217A

High Temperature Solder Paste (217 ° C) 35g Mijing 217A 2

Lutowanie i Reballing

High Temperature Solder Paste (217 ° C) 35g Mijing 217A

zł40.00

High Temperature Solder Paste (217 ° C) 35g Mijing 217A.

JCID Chip underfill UF6008

JCID Chip underfill UF6008 2

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JCID Chip underfill UF6008

zł45.00

The underfill will diffuse to the bottom of the chip evenly within 1-3 minutes. Cure within 1 min/under 150'c or within 5 min/under 100'c automatically

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