Lutowanie i Reballing

Showing 13-24 of 29 item(s)

Medium-Temperature Solder Paste (190°C) 35g Mijing 190A

2591104

zł32.00

Medium-Temperature Solder Paste (190°C) 35g Mijing 190A.

Lutowanie i Reballing

iPhone X/8/8P/SE2020 Big Audio IC- U4700 - 338S00248

245563

zł32.00

iPhone X/8/8P/SE2020 Big Audio IC- U4700 - 338S00248.

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iPhone X/8/8P/SE2020 Transceiver RF - PMB5757

Inna

245574

zł32.00

iPhone X/8/8P/SE2020 Transceiver RF - PMB5757.

Lutowanie i Reballing

iPhone X/8/8P/SE2020 Power IC - PMD9655 - BBPMU

245562

zł32.00

iPhone X/8/8P/SE2020 Power IC - PMD9655 - BBPMU.

Low-Temperature Solder Paste (138°C) 35g Mijing 138A.

Lutowanie i Reballing

Low-Temperature Solder Paste (138°C) 35g Mijing 138A.

2591103

zł32.00

Low-Temperature Solder Paste (138°C) 35g Mijing 138A.

Medium Temperature Solder Paste (189 ° C) 35g Mijing 189A.

Lutowanie i Reballing

Medium Temperature Solder Paste (189 ° C) 35g Mijing 189A.

2591104

zł32.00

Medium Temperature Solder Paste (189 ° C) 35g Mijing 189A..

Lutowanie i Reballing

iPhone X/8/8P/SE2020 Camera Flashlight IC - U3700 - 338S00306

245571

zł40.00

iPhone X/8/8P/SE2020 Camera Flashlight IC - U3700 - 338S00306.

High Temperature Solder Paste (217 ° C) 35g Mijing 217A

Lutowanie i Reballing

High Temperature Solder Paste (217 ° C) 35g Mijing 217A

2591105

zł40.00

High Temperature Solder Paste (217 ° C) 35g Mijing 217A.

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JCID Chip underfill UF6008

2591347

zł45.00

The underfill will diffuse to the bottom of the chip evenly within 1-3 minutes. Cure within 1 min/under 150'c or within 5 min/under 100'c automatically

Lutowanie i Reballing

iPhone X Big Power IC - U2700 - 338S00341-B1

245570

zł75.00

iPhone X Big Power IC - U2700 - 338S00341-B1.

Lutowanie i Reballing

Romeo2 13-14 Series Integrated Face ID Chip

2591402

zł79.00

Romeo2 13-14 Series Integrated Face ID Chip The chip supports: iPhone 13/13mini/13Pro/13Pro max 14/14Plus/ 14 Pro/ 14 Pro Max

Lutowanie i Reballing

iPhone 8/8P/X CPU IC (RAM)

245575

zł155.00

iPhone 8/8P/X CPU IC (RAM).

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