Lutowanie i Reballing Motherboard Holder Mijing K23 Mijing 250847 zł99.00 ADD TO CART Universal holder for K23 motherboards. The product is resistant to high temperatures, equipped with non-slip feet. Producer: Mijing.
Last items in stock Lutowanie i Reballing PCB Mold Mijing CH5 11/11 Pro/11 Pro Max Mijing 258959 zł435.00 ADD TO CART PCB Mold Mijing CH5 11/11 Pro/11 Pro Max. The product enables the separation of the top of the motherboard from the bottom of the iPhone. The heater is made of the highest quality steel and is resistant to high temperatures.
Product available with different options Lutowanie i Reballing Soldering Braid Mechanic R300 1.5m zł9.00 View Scope of application: tin removal Maximum suction: 30 Tin Suction Width: 1.5/2.0/2.5/3.0/3.5mm Tin suction hose length: approx. 1.5 m
Lutowanie i Reballing Sieve for BGA Amaoe Qualcomm CPU-0. QU5 12mm 258991 zł25.50 ADD TO CART Sieve for BGA Amaoe Qualcomm CPU-0. QU5 12mm.
Tools Electric Service Screwdriver With Clutch Fix-Zone Li-01 25072 4 Reviews zł265.00 ADD TO CART FixZone Electric Screwdriver.
LCD Components LCD Frame IPhone 13 Pro 090034 zł40.00 ADD TO CART LCD Frame IPhone 13 Pro ORG. Top-quality frame for iPhone 13 Pro.
Last items in stock Tools Metal Antistatic ESD Opener Jakemy JM-OP13 25044 zł29.00 ADD TO CART Metal Antistatic ESD Opener Jakemy JM-OP13.
Tools Precision Curved Tweezers 258964 zł49.00 ADD TO CART Precision Curved Tweezers FixZone. The tool allows you to grasp small items, will greatly facilitate servicing.
Out-of-Stock Lutowanie i Reballing copy of Sieve for BGA Amaoe Samsung A10-A70 Sam:14 2591319 zł35.00 View Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).
Last items in stock Home Mijing M22 Multi-function Magnetic Planting Tin Insulation Silicone Pad 2591330 zł45.00 ADD TO CART
Lutowanie i Reballing copy of Sieve for BGA Amaoe Samsung A10-A70 Sam:14 2591318 zł35.00 ADD TO CART Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).
Home JCID Chip underfill UF6008 2591347 zł45.00 ADD TO CART The underfill will diffuse to the bottom of the chip evenly within 1-3 minutes. Cure within 1 min/under 150'c or within 5 min/under 100'c automatically