Lutowanie i Reballing Motherboard Holder Mijing K23 Mijing 250847 zł99.00 ADD TO CART Universal holder for K23 motherboards. The product is resistant to high temperatures, equipped with non-slip feet. Producer: Mijing.
Last items in stock Lutowanie i Reballing PCB Mold Mijing CH5 11/11 Pro/11 Pro Max Mijing 258959 zł435.00 ADD TO CART PCB Mold Mijing CH5 11/11 Pro/11 Pro Max. The product enables the separation of the top of the motherboard from the bottom of the iPhone. The heater is made of the highest quality steel and is resistant to high temperatures.
Out-of-Stock Tools Bottle With Dispenser 50 ml 250065 zł7.50 View The product is intended for dosing various types of substances used during the regeneration of displays.
Lutowanie i Reballing copy of Sieve for BGA Amaoe Samsung A10-A70 Sam:14 2591318 zł35.00 ADD TO CART Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).
Product available with different options Lutowanie i Reballing Soldering Braid Mechanic R300 1.5m zł9.00 View Scope of application: tin removal Maximum suction: 30 Tin Suction Width: 1.5/2.0/2.5/3.0/3.5mm Tin suction hose length: approx. 1.5 m
Last items in stock Home Mijing M22 Multi-function Magnetic Planting Tin Insulation Silicone Pad 2591330 zł45.00 ADD TO CART
Tools Lightning Cables iPhone Auto Recovery Mode 258983 zł44.99 ADD TO CART Lightning Cables Auto DFU Qianli. Qianli cable that will significantly speed up your work when servicing Apple devices. The cable automatically switches to iDFU mode after connecting to a computer.
Tools Service Scissors - Ceramic 259927 zł14.49 ADD TO CART Service Scissors - Ceramic. Scissors are perfect for cutting mounting tapes or other materials needed for servicing or regenerating displays.
Tools Precision Curved Tweezers 258964 zł49.00 ADD TO CART Precision Curved Tweezers FixZone. The tool allows you to grasp small items, will greatly facilitate servicing.
Home JCID Chip underfill UF6008 2591347 zł45.00 ADD TO CART The underfill will diffuse to the bottom of the chip evenly within 1-3 minutes. Cure within 1 min/under 150'c or within 5 min/under 100'c automatically
Lutowanie i Reballing Sieve for BGA Amaoe Qualcomm CPU-0. QU5 12mm 258991 zł25.50 ADD TO CART Sieve for BGA Amaoe Qualcomm CPU-0. QU5 12mm.
LCD Glass LCD Glass iPhone 13/13 Pro + OCA A+ 0398021 zł22.00 ADD TO CART LCD Glass iPhone 13/13 Pro + OCA A+. Top-quality glass for iPhone 13/13 Pro.