Lutowanie i Reballing

Showing 25-36 of 57 item(s)

Medium Temperature Solder Paste (189 ° C) 35g Mijing 189A.

Medium Temperature Solder Paste (189 ° C) 35g Mijing 189A. 2

Lutowanie i Reballing

Medium Temperature Solder Paste (189 ° C) 35g Mijing 189A.

zł32.00

Medium Temperature Solder Paste (189 ° C) 35g Mijing 189A..

Angled Nozzles for Hot-Air Nozzle Soldering Iron ⌀5mm

Angled Nozzles for Hot-Air Nozzle Soldering Iron ⌀5mm 2

Home

Angled Nozzles for Hot-Air Nozzle Soldering Iron ⌀5mm

zł35.00

Angled Nozzles for Hot-Air Nozzle Soldering Iron ⌀5mm.

Angled Nozzles for Hot-Air Nozzle Soldering Iron ⌀8mm

Angled Nozzles for Hot-Air Nozzle Soldering Iron ⌀8mm 2

Home

Angled Nozzles for Hot-Air Nozzle Soldering Iron ⌀8mm

zł35.00

Angled Nozzles for Hot-Air Nozzle Soldering Iron ⌀8mm.

Angled Nozzles for Hot-Air Nozzle Soldering Iron ⌀4mm

Angled Nozzles for Hot-Air Nozzle Soldering Iron ⌀4mm 2

Home

Angled Nozzles for Hot-Air Nozzle Soldering Iron ⌀4mm

zł35.00

Angled Nozzles for Hot-Air Nozzle Soldering Iron ⌀4mm.

Angled Nozzles for Hot-Air...

Angled Nozzles for Hot-Air... 2

Home

Angled Nozzles for Hot-Air Nozzle Soldering Iron ⌀10mm

zł35.00

Angled Nozzles for Hot-Air Nozzle Soldering Iron ⌀10mm.

Angled Nozzles for Hot-Air Nozzle Soldering Iron ⌀6mm

Angled Nozzles for Hot-Air Nozzle Soldering Iron ⌀6mm 2

Home

Angled Nozzles for Hot-Air Nozzle Soldering Iron ⌀6mm

zł35.00

Angled Nozzles for Hot-Air Nozzle Soldering Iron ⌀6mm.

Mijing Soldering Braid 2mm...

Mijing Soldering Braid 2mm... 2

Lutowanie i Reballing

Mijing Soldering Braid 2mm (5 psc)

zł36.00

Braid specifications: Specially adapted flux formula. Tin absorption capacity increased by 60%. Antioxidant formula. No residue, easy to clean. Model 2020: Length: 2.0 m, Width: 2.0 mm. Model 2015: Length: 1.5 m, Width: 2.0 mm.

iPhone X/8/8P/SE2020 Camera Flashlight IC - U3700 - 338S00306

Lutowanie i Reballing

iPhone X/8/8P/SE2020 Camera Flashlight IC - U3700 - 338S00306

zł40.00

iPhone X/8/8P/SE2020 Camera Flashlight IC - U3700 - 338S00306.

High Temperature Solder Paste (217 ° C) 35g Mijing 217A

High Temperature Solder Paste (217 ° C) 35g Mijing 217A 2

Lutowanie i Reballing

High Temperature Solder Paste (217 ° C) 35g Mijing 217A

zł40.00

High Temperature Solder Paste (217 ° C) 35g Mijing 217A.

JCID Chip underfill UF6008

JCID Chip underfill UF6008 2

Home

JCID Chip underfill UF6008

zł45.00

The underfill will diffuse to the bottom of the chip evenly within 1-3 minutes. Cure within 1 min/under 150'c or within 5 min/under 100'c automatically

Mijing M22 Multi-function...

Mijing M22 Multi-function... 2

Home

Mijing M22 Multi-function Magnetic Planting Tin Insulation Silicone Pad

zł45.00

Plate for LCD Protection iPhone 13 Pro Max

Plate for LCD Protection iPhone 13 Pro Max 2

Lutowanie i Reballing

Plate to Protect the LCD During Milling IC Touch iPhone 13 Pro Max

zł43.00

A special plate to protect the displays while milling the touch system.

1
2
3
4
5

W celu poprawienia jakości usług korzystamy z plików cookies. Pozostając na stronie, wyrażasz zgodę na wykorzystanie tej technologii.