List of products by brand Mijing

Showing 25-29 of 29 item(s)

PCB Mold Mijing CH5 11/11 Pro/11 Pro Max

Lutowanie i Reballing

PCB Mold Mijing CH5 11/11 Pro/11 Pro Max

zł435.00

PCB Mold Mijing CH5 11/11 Pro/11 Pro Max. The product enables the separation of the top of the motherboard from the bottom of the iPhone. The heater is made of the highest quality steel and is resistant to high temperatures.

PCB Mold Mijing CH5-E 12/12...

Lutowanie i Reballing

PCB Mold Mijing CH5-E 12/12 Pro/12 Pro Max/12 Mini

zł460.00

PCB Mold Mijing CH5-E 12/12 Pro/12 Pro Max/12 Mini. The product enables the separation of the top of the motherboard from the bottom of the iPhone. The heater is made of the highest quality steel and is resistant to high temperatures.

Universal PCB Heater Mijing MS1 5in1

Universal PCB Heater Mijing MS1 5in1 2

Lutowanie i Reballing

Universal PCB Heater Mijing MS1 5in1

zł599.00

Multifunctional iRepair MS1 reheating station. The product supports the X -13 and FaceID series. The set includes a heater, universal form power supply and 4 dedicated forms. Thanks to this product, it is possible to separate the upper part of the motherboard from the upper one and carry out a complete BGA reballing. The heater is made of steel...

Motherboard Test Holder Mijing C17 iPhone X/XS/Xs Max

Motherboard Test Holder Mijing C17 iPhone X/XS/Xs Max 2

Tools

Motherboard Test Holder Mijing C17 iPhone X/XS/Xs Max

zł680.00

Motherboard Test Holder Mijing C17 iPhone X/XS/Xs Max. A device from the renowned Mijing brand that allows you to check the efficiency of the motherboard after the work carried out without the need to reball the middle layer (so-called sandwiches).

Motherboard Test Holder Mijing C21-A iPhone 13 Pro/13 Pro Max

Motherboard Test Holder Mijing C21-A iPhone 13 Pro/13 Pro Max 2

Tools

Motherboard Test Holder Mijing C21-A iPhone 13 Mini/1313 Pro/13 Pro Max

zł1,369.00

Motherboard Test Holder Mijing C21-A iPhone 13 Mini/1313 Pro/13 Pro Max. A device from the renowned Mijing brand that allows you to check the efficiency of the motherboard after the work carried out without the need to reball the middle layer (so-called sandwiches).

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