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New Lutowanie i Reballing Romeo2 X-12PM Integrated Face ID Chip 2591401 zł28.00 ADD TO CART Romeo2 X-12PM Integrated Face ID chip The chip supports: iPhone X-12PM
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Lutowanie i Reballing copy of Sieve for BGA Amaoe Samsung A10-A70 Sam:14 2591321 zł35.00 ADD TO CART Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).
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Home JCID Chip underfill UF6008 2591347 zł45.00 ADD TO CART The underfill will diffuse to the bottom of the chip evenly within 1-3 minutes. Cure within 1 min/under 150'c or within 5 min/under 100'c automatically
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