Amaoe IP17-012 – BGA Reballing Stencil 0.12mm for iPhone 17 (Middle Layer)

Amaoe IP17-012 – BGA Reballing Stencil 0.12mm for iPhone 17 (Middle Layer)

High-precision reballing stencil designed for iPhone 17 motherboard middle layer repairs. Ideal for professional BGA microsoldering applications.

The Amaoe IP17-012 is a 0.12mm thick stainless steel stencil engineered for accurate and efficient BGA reballing on the middle layer of iPhone 17 logic boards. Its laser-cut micro-holes ensure precise solder ball placement, minimizing errors and reducing repair time. Built for durability and reusability, this stencil is trusted by professional microsoldering technicians worldwide.

Key Features:

• Model: IP17-012

• Application: Middle layer reballing for iPhone 17 motherboard

• Material: High-grade stainless steel

• Thickness: 0.12mm – perfect balance between flexibility and rigidity

• Precision: Laser-cut holes ensure accurate solder ball alignment

• Reusable: Designed for multiple uses without deformation

• Compatible with: Hot air rework stations and BGA reballing platforms