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Amaoe U-SMU1 – 0.12mm BGA Reballing...

Amaoe U-SMU1 – 0.12mm BGA Reballing Stencil for Samsung Exynos CPUs

Amaoe
2591470
zł40.00
VAT included

Amaoe U-SMU1 – 0.12mm BGA Reballing Stencil for Samsung Exynos CPUs

The Amaoe U-SMU1 is a professional-grade BGA stencil designed for reballing and repairing Samsung Exynos CPUs. With a thickness of 0.12mm and laser-cut precision, this stencil ensures accurate and consistent solder placement for both technicians and repair experts.

Amaoe U-SMU1 – 0.12mm BGA Reballing Stencil for Samsung Exynos CPUs

The Amaoe U-SMU1 is a professional-grade BGA stencil designed for reballing and repairing Samsung Exynos CPUs. With a thickness of 0.12mm and laser-cut precision, this stencil ensures accurate and consistent solder placement for both technicians and repair experts.

Key Features:

  • Model: U-SMU1

  • Thickness: 0.12mm

  • Material: High-quality stainless steel

  • Designed for UBGA reballing platforms

  • Reusable, durable, and heat-resistant

Compatible With:

  • Exynos8895-1703

  • Exynos8895 + RAM

  • Exynos3475 / 3470

  • Exynos7870 / 7880

  • Exynos7570 / 7580

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