• New
Amaoe U-IP13 Reballing Stencil 0.12MM...

Amaoe U-IP13 Reballing Stencil 0.12MM for iPhone 17, A19, A19 Pro

Amaoe
2591477
zł40.00
VAT included

Amaoe U-IP13 Reballing Stencil 0.12MM for iPhone 17, A19, A19 Pro

Professional BGA stencil designed for precision reballing of Apple A19 and A19 Pro chipsets, compatible with iPhone 17/Pro/Pro Max/Air series. Crafted from high-quality stainless steel, it ensures accurate soldering and long-lasting durability, ideal for professional microsoldering.

Amaoe U-IP13 Reballing Stencil 0.12MM for iPhone 17, A19, A19 Pro

Professional BGA stencil designed for precision reballing of Apple A19 and A19 Pro chipsets, compatible with iPhone 17/Pro/Pro Max/Air series. Crafted from high-quality stainless steel, it ensures accurate soldering and long-lasting durability, ideal for professional microsoldering.

Key Features:

  • Model: U-IP13

  • Compatibility: iPhone 17 / iPhone 17 Pro / iPhone 17 Pro Max / iPhone 17 Air

  • Chipset Support: A19, A19 Pro

  • Material: High-durability stainless steel

  • Thickness: 0.12 mm

  • Precise hole layout for flawless solder ball alignment

  • Anti-warp and heat-resistant properties

Perfect for use in advanced electronics repair and rework stations.

No reviews