Lutowanie i Reballing Sieve for BGA Amaoe iPhone 6/6P-A8 T-0.12mm Amaoe 240900 zł35.00 ADD TO CART Sieve for BGA Amaoe iPhone 6/6P-A8 T-0.12mm.
Lutowanie i Reballing Sieve for BGA Amaoe iPhone 6S/6SP-A9 T-0.12mm Amaoe 240904 zł35.00 ADD TO CART Sieve for BGA Amaoe iPhone 6S/6SP-A9 T-0.12mm.
LCD Glass LCD Glass Huawei P30 + OCA A+ 0388000 zł20.00 ADD TO CART LCD Glass Huawei P30 + OCA A+. Highest quality Huawei P30 LCD Display glass.
Last items in stock Lutowanie i Reballing PCB Heater Board X360 iPhone 12-12 Pro Max 250852 zł99.00 ADD TO CART PCB Heater Board X360 iPhone 12-12 Pro Max.
Lutowanie i Reballing Sieve for BGA Amaoe iPhone iPhone 7/7P - A10 T:0.12mm 240919 zł35.00 ADD TO CART Sieve for BGA Amaoe iPhone iPhone 7/7P - A10 T:0.12mm.
Lutowanie i Reballing Sieve for BGA Amaoe iPhone 12/Pro/Max/12mini - A14 T:0.12mm 240918 zł35.00 ADD TO CART Sieve for BGA Amaoe iPhone iPhone 12/Pro/Max/12mini - A14 T:0.12mm.
Lutowanie i Reballing Sieve for BGA Amaoe iPhone 13/Pro/Max/13mini - A15 T:0.12mm 240917 zł35.00 ADD TO CART Sieve for BGA Amaoe iPhone iPhone 13/Pro/Max/13mini - A15 T:0.12mm.
Lutowanie i Reballing Plate to Protect the LCD During Milling IC Touch iPhone 12/12 Pro 259892 zł43.00 ADD TO CART A special plate to protect the displays while milling the touch system.
Lutowanie i Reballing Medium Temperature Solder Paste (189 ° C) 35g Mijing 189A. 2591104 zł32.00 ADD TO CART Medium Temperature Solder Paste (189 ° C) 35g Mijing 189A..
Lutowanie i Reballing Sieve for BGA Amaoe iPhone XS/XS Max/XR - A13 T:0.12mm 240921 zł35.00 ADD TO CART Sieve for BGA Amaoe iPhone iPhone XS/XS Max/XR - A13 T:0.12mm.
Tools JCID iPhone 11 Pro/11 Pro Max Flex Battery (For Battery Status Update) Without Soldering 240894 zł49.00 ADD TO CART JCID iPhone 11 Pro/11 Pro Max Flex Battery (For Battery Status Update) Without Soldering.
Out-of-Stock Lutowanie i Reballing Universal PCB Heater Mijing MS1 5in1 258986 zł599.00 View Multifunctional iRepair MS1 reheating station. The product supports the X -13 and FaceID series. The set includes a heater, universal form power supply and 4 dedicated forms. Thanks to this product, it is possible to separate the upper part of the motherboard from the upper one and carry out a complete BGA reballing. The heater is made of steel...