Lutowanie i Reballing Sieve for BGA Amaoe iPhone 6/6P-A8 T-0.12mm Amaoe 240900 zł35.00 ADD TO CART Sieve for BGA Amaoe iPhone 6/6P-A8 T-0.12mm.
Lutowanie i Reballing Sieve for BGA Amaoe iPhone 6S/6SP-A9 T-0.12mm Amaoe 240904 zł35.00 ADD TO CART Sieve for BGA Amaoe iPhone 6S/6SP-A9 T-0.12mm.
Lutowanie i Reballing Sieve for BGA Amaoe iPhone 13/Pro/Max/13mini - A15 T:0.12mm Amaoe 240917 zł35.00 ADD TO CART Sieve for BGA Amaoe iPhone iPhone 13/Pro/Max/13mini - A15 T:0.12mm.
Lutowanie i Reballing Sieve for BGA Amaoe iPhone 12/Pro/Max/12mini - A14 T:0.12mm Amaoe 240918 zł35.00 ADD TO CART Sieve for BGA Amaoe iPhone iPhone 12/Pro/Max/12mini - A14 T:0.12mm.
Lutowanie i Reballing Sieve for BGA Amaoe Qualcomm CPU-0. QU5 12mm 258991 zł25.50 ADD TO CART Sieve for BGA Amaoe Qualcomm CPU-0. QU5 12mm.
Tools Touch IC Milling Tip (4mm Disc) 258967 zł9.00 ADD TO CART Touch IC Milling Tip (4mm Disc). Precise milling cutter enabling milling of small parts.
Regeneration Tools LCD Cleaning Sponge 240015 zł2.99 ADD TO CART Flexible and tough sponge for cleaning LCD displays from glue residues.
Lutowanie i Reballing Sieve for BGA Amaoe Samsung A10-A70 Sam:14 2400004 zł35.00 ADD TO CART Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).
Lutowanie i Reballing Low-Temperature Solder Paste (138°C) 35g Mijing 138A. 2591103 zł32.00 ADD TO CART Low-Temperature Solder Paste (138°C) 35g Mijing 138A.
Tools Opener FixZone 250730 zł16.00 ADD TO CART Opener FixZone. - Tool made of steel. - A very handy and precise product.
Lutowanie i Reballing Plate to Protect the LCD During Milling IC Touch iPhone 12/12 Pro 259892 zł43.00 ADD TO CART A special plate to protect the displays while milling the touch system.
Lutowanie i Reballing Sieve for BGA Amaoe iPhone 13/Pro/Max/13mini - A15 T:0.12mm Amaoe 240917 zł35.00 ADD TO CART Sieve for BGA Amaoe iPhone iPhone 13/Pro/Max/13mini - A15 T:0.12mm.
Lutowanie i Reballing Medium-Temperature Solder Paste (190°C) 35g Mijing 190A 2591104 zł32.00 ADD TO CART Medium-Temperature Solder Paste (190°C) 35g Mijing 190A.
Lutowanie i Reballing Sieve for BGA Amaoe iPhone X/8P/8-1A11 T:0.12mm 240916 zł35.00 ADD TO CART Sieve for BGA Amaoe iPhone X/8P/8-1A11 T:0.12mm.