Lutowanie i Reballing Sieve for BGA Amaoe iPhone 6/6P-A8 T-0.12mm Amaoe 240900 zł35.00 ADD TO CART Sieve for BGA Amaoe iPhone 6/6P-A8 T-0.12mm.
Lutowanie i Reballing Sieve for BGA Amaoe iPhone 6S/6SP-A9 T-0.12mm Amaoe 240904 zł35.00 ADD TO CART Sieve for BGA Amaoe iPhone 6S/6SP-A9 T-0.12mm.
Lutowanie i Reballing Sieve for BGA Amaoe iPhone X/8P/8-1A11 T:0.12mm Amaoe 240916 zł35.00 ADD TO CART Sieve for BGA Amaoe iPhone X/8P/8-1A11 T:0.12mm.
Lutowanie i Reballing Sieve for BGA Amaoe iPhone 12/Pro/Max/12mini - A14 T:0.12mm Amaoe 240918 zł35.00 ADD TO CART Sieve for BGA Amaoe iPhone iPhone 12/Pro/Max/12mini - A14 T:0.12mm.
Lutowanie i Reballing copy of Sieve For BGA LCD Touch Controller Chips iPhone 6S-15 LCD3 V3.0 2591395 zł33.00 ADD TO CART Sieve For BGA LCD Touch Controller Chips iPhone 6S-15 LCD3 V3.0.
Home Angled Nozzles for Hot-Air Nozzle Soldering Iron ⌀10mm 2591254 zł35.00 ADD TO CART Angled Nozzles for Hot-Air Nozzle Soldering Iron ⌀10mm.
Out-of-Stock Lutowanie i Reballing copy of Sieve for BGA Amaoe Samsung A10-A70 Sam:14 2591385 zł35.00 View Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).