Amaoe U-SMU3 – 0.12mm BGA Stencil for Samsung Exynos CPU Chips

Brand: Amaoe

Reference 2591472

zł40.00

VAT included

The Amaoe U-SMU3 is a high-quality BGA stencil made of ultra-durable stainless steel, precisely designed for reballing Samsung Exynos CPU series chips. With 0.12mm thickness and excellent heat resistance, it is a perfect choice for advanced technicians and GSM service centers.

The Amaoe U-SMU3 is a high-quality BGA stencil made of ultra-durable stainless steel, precisely designed for reballing Samsung Exynos CPU series chips. With 0.12mm thickness and excellent heat resistance, it is a perfect choice for advanced technicians and GSM service centers.

Product Features:

Model: U-SMU3
Thickness: 0.12mm
Material: Heat-resistant stainless steel
UBGA format – ideal for chip-level repair
Durable and reusable
Ventilation holes prevent warping during use

Supported Chipsets:

Exynos2100
Exynos9815 / 1080
Exynos990
Exynos9820
Exynos2200 / E9925
RAM 496
RAM 556
Exynos9810

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