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Amaoe U-QSU5 – BGA Reballing Stencil...

Amaoe U-QSU5 – BGA Reballing Stencil 0.12mm for Qualcomm Snapdragon CPUs

Amaoe
2591473
zł40.00
VAT included

Amaoe U-QSU5 – BGA Reballing Stencil 0.12mm for Qualcomm Snapdragon CPUs

The Amaoe U-QSU5 BGA stencil is a professional-grade tool designed for precise reballing of Qualcomm Snapdragon processors. Made from high-quality stainless steel with a 0.12mm thickness, it ensures accurate solder ball placement and stable performance during rework.

Amaoe U-QSU5 – BGA Reballing Stencil 0.12mm for Qualcomm Snapdragon CPUs

The Amaoe U-QSU5 BGA stencil is a professional-grade tool designed for precise reballing of Qualcomm Snapdragon processors. Made from high-quality stainless steel with a 0.12mm thickness, it ensures accurate solder ball placement and stable performance during rework.

Product Features:

  • Model: U-QSU5

  • Thickness: 0.12mm

  • Material: High-temperature resistant stainless steel

  • Heat-dissipating hole design – prevents warping during rework

  • Reusable and durable

  • UBGA layout – ideal for precise CPU reballing

Supported Chips:

  1. Snapdragon 888 / SM8350

  2. Snapdragon 865 / 870 – SM8250-002

  3. Snapdragon 865 – SM8250-102

  4. Snapdragon 7+ Gen2 / SM7475 / 8+ Gen1 / 8425

  5. Snapdragon 8 Gen1 – SM8450

  6. RAM 496

  7. RAM 556

  8. Snapdragon 8 Gen2 – SM8550

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