Amaoe U-IP12 BGA Stencil 0.12MM – for A18 / A18 Pro / iPhone 16 Series
AmaoeAmaoe U-IP12 BGA Stencil 0.12MM – for A18 / A18 Pro / iPhone 16 Series
The Amaoe U-IP12 is a high-precision BGA stencil crafted for professionals working with iPhone 16, iPhone 16 Plus, Pro, Pro Max, and e-series logic boards. Designed for reballing A18 and A18 Pro CPU chips, this 0.12mm stencil ensures stable operation, precise alignment, and excellent heat resistance during rework or repair.
Amaoe U-IP12 BGA Stencil 0.12MM – for A18 / A18 Pro / iPhone 16 Series
The Amaoe U-IP12 is a high-precision BGA stencil crafted for professionals working with iPhone 16, iPhone 16 Plus, Pro, Pro Max, and e-series logic boards. Designed for reballing A18 and A18 Pro CPU chips, this 0.12mm stencil ensures stable operation, precise alignment, and excellent heat resistance during rework or repair.
Product Features:
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Model: U-IP12
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Thickness: 0.12 mm
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Supported Chips: Apple A18 / A18 Pro
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Compatibility: iPhone 16 / 16 Plus / 16 Pro / 16 Pro Max / e
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Material: High-strength stainless steel
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Use Case: Reballing and soldering of iPhone CPU and associated chips
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Durable, anti-slip, and heat-resistant
A must-have stencil for technicians and repair specialists dealing with the latest iPhones.
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