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Amaoe U-QSD12 BGA Reballing Stencil...

Amaoe U-QSD12 BGA Reballing Stencil 0.12MM – SM7635 / SM7550 / SM6450 / SM4450 / Snapdragon Gen3/Gen2/Gen1

Amaoe
2591480
zł40.00
VAT included

Amaoe U-QSD12 BGA Reballing Stencil 0.12MM – SM7635 / SM7550 / SM6450 / SM4450 / Snapdragon Gen3/Gen2/Gen1

The Amaoe U-QSD12 is a high-precision reballing stencil designed for professional repair of modern mobile devices. It is ideal for reballing Qualcomm Snapdragon chips including Gen3, Gen2, Gen1, as well as SM7635, SM7550, SM6450, and SM4450.

Amaoe U-QSD12 BGA Reballing Stencil 0.12MM – SM7635 / SM7550 / SM6450 / SM4450 / Snapdragon Gen3/Gen2/Gen1

The Amaoe U-QSD12 is a high-precision reballing stencil designed for professional repair of modern mobile devices. It is ideal for reballing Qualcomm Snapdragon chips including Gen3, Gen2, Gen1, as well as SM7635, SM7550, SM6450, and SM4450.

Product Features:

  • Model: U-QSD12

  • Thickness: 0.12 mm

  • Supported chips: Snapdragon Gen3 / Gen2 / Gen1, SM7635, SM7550, SM6450, SM4450

  • Material: Super hard stainless steel

  • Use case: CPU and memory IC reballing for smartphones

  • Durable and heat-resistant design

A must-have tool for advanced technicians seeking precision and durability in BGA rework tasks.

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