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Amaoe U-QSD11 0.12MM Reballing...

Amaoe U-QSD11 0.12MM Reballing Stencil – Snapdragon Gen2/Gen3/8s (SM8550, SM8650, SM8635)

Amaoe
2591482
zł40.00
VAT included

Amaoe U-QSD11 0.12MM Reballing Stencil – Snapdragon Gen2/Gen3/8s (SM8550, SM8650, SM8635)

Professional BGA reballing stencil by Amaoe – model U-QSD11 – designed for precise motherboard repair of mobile devices. Compatible with the latest Qualcomm Snapdragon chips, perfect for CPU, RAM, and PMIC soldering work.

Amaoe U-QSD11 0.12MM Reballing Stencil – Snapdragon Gen2/Gen3/8s (SM8550, SM8650, SM8635)

Professional BGA reballing stencil by Amaoe – model U-QSD11 – designed for precise motherboard repair of mobile devices. Compatible with the latest Qualcomm Snapdragon chips, perfect for CPU, RAM, and PMIC soldering work.

Key Features:

  • Model: U-QSD11

  • Thickness: 0.12 mm

  • Compatibility: SM8550, SM8650, SM8635, Snapdragon 8 Gen3, 8 Gen2, 8s

  • Use: Reballing CPU, RAM, power ICs

  • Material: High-quality stainless steel, heat-resistant

  • Magnetic Base: Ensures stability during work

Ideal choice for advanced electronics repair shops and GSM technicians handling high-performance smartphones.

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