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Amaoe U-QSU6 0.12MM BGA Reballing...

Amaoe U-QSU6 0.12MM BGA Reballing Stencil – Snapdragon Gen3/Gen2/Gen1 (SM8750, SM8650, SM8635, SM7635, SM6450, SM4450, SM7550)

Amaoe
2591481
zł40.00
VAT included

Amaoe U-QSU6 0.12MM BGA Reballing Stencil – Snapdragon Gen3/Gen2/Gen1 (SM8750, SM8650, SM8635, SM7635, SM6450, SM4450, SM7550)

The Amaoe U-QSU6 is a high-precision BGA reballing stencil designed for advanced repair work on mobile device motherboards. It supports the latest Qualcomm Snapdragon chipsets and various related components.

Amaoe U-QSU6 0.12MM BGA Reballing Stencil – Snapdragon Gen3/Gen2/Gen1 (SM8750, SM8650, SM8635, SM7635, SM6450, SM4450, SM7550)

The Amaoe U-QSU6 is a high-precision BGA reballing stencil designed for advanced repair work on mobile device motherboards. It supports the latest Qualcomm Snapdragon chipsets and various related components.

Product Features:

  • Model: U-QSU6

  • Thickness: 0.12 mm

  • Compatibility: Snapdragon SM8750, SM8650, SM8635, SM7635, SM6450, SM4450, SM7550

  • Application: CPU, RAM, power IC reballing and repairs

  • Material: High-quality stainless steel, heat-resistant

  • Magnetic Base: Ensures stable positioning during work

Perfect for professional repair technicians and advanced mobile service centers.

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