Last items in stock Home Angled Nozzles for Hot-Air Nozzle Soldering Iron ⌀4mm 2591253 zł35.00 ADD TO CART Angled Nozzles for Hot-Air Nozzle Soldering Iron ⌀4mm.
Home Angled Nozzles for Hot-Air Nozzle Soldering Iron ⌀10mm 2591254 zł35.00 ADD TO CART Angled Nozzles for Hot-Air Nozzle Soldering Iron ⌀10mm.
Home Angled Nozzles for Hot-Air Nozzle Soldering Iron ⌀6mm 2591261 zł35.00 ADD TO CART Angled Nozzles for Hot-Air Nozzle Soldering Iron ⌀6mm.
Lutowanie i Reballing Sieve for BGA Amaoe Samsung A10-A70 Sam:14 2400004 zł35.00 ADD TO CART Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).
Lutowanie i Reballing Mijing Soldering Braid 2mm (5 psc) zł36.00 ADD TO CART Braid specifications: Specially adapted flux formula. Tin absorption capacity increased by 60%. Antioxidant formula. No residue, easy to clean. Model 2020: Length: 2.0 m, Width: 2.0 mm. Model 2015: Length: 1.5 m, Width: 2.0 mm.
Lutowanie i Reballing Sieve for BGA Amaoe iPhone 6S/6SP-A9 T-0.12mm 240904 zł35.00 ADD TO CART Sieve for BGA Amaoe iPhone 6S/6SP-A9 T-0.12mm.
Lutowanie i Reballing Sieve for BGA Amaoe iPhone 6/6P-A8 T-0.12mm 240900 zł35.00 ADD TO CART Sieve for BGA Amaoe iPhone 6/6P-A8 T-0.12mm.
Last items in stock Lutowanie i Reballing Sieve for BGA Amaoe iPhone 11/Pro/max - A13 T:0.12mm 240920 zł35.00 ADD TO CART Sieve for BGA Amaoe iPhone 11/Pro/max - A13 T:0.12mm.
Lutowanie i Reballing Sieve for BGA Amaoe iPhone iPhone 7/7P - A10 T:0.12mm 240919 zł35.00 ADD TO CART Sieve for BGA Amaoe iPhone iPhone 7/7P - A10 T:0.12mm.
Lutowanie i Reballing Sieve for BGA Amaoe iPhone XS/XS Max/XR - A13 T:0.12mm 240921 zł35.00 ADD TO CART Sieve for BGA Amaoe iPhone iPhone XS/XS Max/XR - A13 T:0.12mm.
Lutowanie i Reballing Sieve for BGA Amaoe iPhone 12/Pro/Max/12mini - A14 T:0.12mm 240918 zł35.00 ADD TO CART Sieve for BGA Amaoe iPhone iPhone 12/Pro/Max/12mini - A14 T:0.12mm.
Lutowanie i Reballing Sieve for BGA Amaoe iPhone 13/Pro/Max/13mini - A15 T:0.12mm 240917 zł35.00 ADD TO CART Sieve for BGA Amaoe iPhone iPhone 13/Pro/Max/13mini - A15 T:0.12mm.
Lutowanie i Reballing Sieve for BGA Amaoe iPhone X/8P/8-1A11 T:0.12mm 240916 zł35.00 ADD TO CART Sieve for BGA Amaoe iPhone X/8P/8-1A11 T:0.12mm.
Last items in stock Lutowanie i Reballing BGA LCD Screens for iPhone 6-11 240847 zł39.99 ADD TO CART BGA LCD Screens for iPhone 6-11.
Lutowanie i Reballing High Temperature Solder Paste (217 ° C) 35g Mijing 217A 2591105 zł40.00 ADD TO CART High Temperature Solder Paste (217 ° C) 35g Mijing 217A.
Lutowanie i Reballing BGA Sieves iPhone Face ID 250801 zł42.00 ADD TO CART BGA Sieves iPhone Face ID.
Home JCID Chip underfill UF6008 2591347 zł45.00 ADD TO CART The underfill will diffuse to the bottom of the chip evenly within 1-3 minutes. Cure within 1 min/under 150'c or within 5 min/under 100'c automatically
Home Mijing M22 Multi-function Magnetic Planting Tin Insulation Silicone Pad 2591330 zł45.00 ADD TO CART
Lutowanie i Reballing Plate to Protect the LCD During Milling IC Touch iPhone 13 Pro Max 259897 zł43.00 ADD TO CART A special plate to protect the displays while milling the touch system.
Lutowanie i Reballing Plate to Protect the LCD During Milling IC Touch iPhone 13 Pro 259896 zł43.00 ADD TO CART A special plate to protect the displays while milling the touch system.
Lutowanie i Reballing Plate to Protect the LCD During Milling IC Touch iPhone iPhone 13 259895 zł43.00 ADD TO CART A special plate to protect the displays while milling the touch system.
Lutowanie i Reballing Plate to Protect the LCD During Milling IC Touch iPhone 13 Mini 259894 zł43.00 ADD TO CART A special plate to protect the displays while milling the touch system.
Lutowanie i Reballing Plate to Protect the LCD During Milling IC Touch iPhone 12 Pro Max 259893 zł43.00 ADD TO CART A special plate to protect the displays while milling the touch system.