Lutowanie i Reballing

Showing 49-72 of 96 item(s)

copy of Sieve for BGA Amaoe Samsung A10-A70 Sam:14

zł35.00

Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).

Lutowanie i Reballing

copy of Sieve for BGA Amaoe Samsung A10-A70 Sam:14

2591322

zł35.00

Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).

Lutowanie i Reballing

copy of Sieve for BGA Amaoe Samsung A10-A70 Sam:14

2591321

zł35.00

Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).

Lutowanie i Reballing

copy of Sieve for BGA Amaoe Samsung A10-A70 Sam:14

2591320

zł35.00

Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).

Lutowanie i Reballing

copy of Sieve for BGA Amaoe Samsung A10-A70 Sam:14

2591319

zł35.00

Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).

Lutowanie i Reballing

copy of Sieve for BGA Amaoe Samsung A10-A70 Sam:14

2591318

zł35.00

Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).

Lutowanie i Reballing

copy of Sieve for BGA Amaoe Samsung A10-A70 Sam:14

2591317

zł35.00

Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).

Lutowanie i Reballing

Sieve for BGA Amaoe Samsung A10-A70 Sam:14

2400004

zł35.00

Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).

Lutowanie i Reballing

Sieve for BGA Amaoe iPhone 6S/6SP-A9 T-0.12mm

240904

zł35.00

Sieve for BGA Amaoe iPhone 6S/6SP-A9 T-0.12mm.

Lutowanie i Reballing

Sieve for BGA Amaoe iPhone 6/6P-A8 T-0.12mm

240900

zł35.00

Sieve for BGA Amaoe iPhone 6/6P-A8 T-0.12mm.

Lutowanie i Reballing

Sieve for BGA Amaoe iPhone 11/Pro/max - A13 T:0.12mm

240920

zł35.00

Sieve for BGA Amaoe iPhone 11/Pro/max - A13 T:0.12mm.

Lutowanie i Reballing

Sieve for BGA Amaoe iPhone iPhone 7/7P - A10 T:0.12mm

240919

zł35.00

Sieve for BGA Amaoe iPhone iPhone 7/7P - A10 T:0.12mm.

Sieve for BGA Amaoe iPhone iPhone XS/XS Max/XR - A13 T:0.12mm

Lutowanie i Reballing

Sieve for BGA Amaoe iPhone XS/XS Max/XR - A13 T:0.12mm

240921

zł35.00

Sieve for BGA Amaoe iPhone iPhone XS/XS Max/XR - A13 T:0.12mm.

Lutowanie i Reballing

Sieve for BGA Amaoe iPhone 12/Pro/Max/12mini - A14 T:0.12mm

240918

zł35.00

Sieve for BGA Amaoe iPhone iPhone 12/Pro/Max/12mini - A14 T:0.12mm.

Sieve for BGA Amaoe iPhone iPhone 13/Pro/Max/13mini - A15 T:0.12mm

Lutowanie i Reballing

Sieve for BGA Amaoe iPhone 13/Pro/Max/13mini - A15 T:0.12mm

240917

zł35.00

Sieve for BGA Amaoe iPhone iPhone 13/Pro/Max/13mini - A15 T:0.12mm.

Lutowanie i Reballing

Sieve for BGA Amaoe iPhone X/8P/8-1A11 T:0.12mm

240916

zł35.00

Sieve for BGA Amaoe iPhone X/8P/8-1A11 T:0.12mm.

Lutowanie i Reballing

BGA LCD Screens for iPhone 6-11

240847

zł39.99

BGA LCD Screens for iPhone 6-11.

Lutowanie i Reballing

iPhone X/8/8P/SE2020 Camera Flashlight IC - U3700 - 338S00306

245571

zł40.00

iPhone X/8/8P/SE2020 Camera Flashlight IC - U3700 - 338S00306.

High Temperature Solder Paste (217 ° C) 35g Mijing 217A

Lutowanie i Reballing

High Temperature Solder Paste (217 ° C) 35g Mijing 217A

2591105

zł40.00

High Temperature Solder Paste (217 ° C) 35g Mijing 217A.

Lutowanie i Reballing

BGA Sieves iPhone Face ID

250801

zł42.00

BGA Sieves iPhone Face ID.

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JCID Chip underfill UF6008

2591347

zł45.00

The underfill will diffuse to the bottom of the chip evenly within 1-3 minutes. Cure within 1 min/under 150'c or within 5 min/under 100'c automatically

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Mijing M22 Multi-function Magnetic Planting Tin Insulation Silicone Pad

2591330

zł45.00

Lutowanie i Reballing

Multi-funcino glue remover blade MaAnt MY-102

2591326

zł45.00

Out-of-Stock

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copy of Mijing M22 Multi-function Magnetic Planting Tin Insulation Silicone Pad

2591331

zł49.00

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