Amaoe UG2-20 V2.0 – Global CPU BGA Reballing Stencil Set (20 pcs)

Amaoe UG2-20 V2.0 – Global CPU BGA Reballing Stencil Set (20 pcs)

Professional universal stencil kit for reballing various smartphone CPU chips. Compatible with processors from Apple, Qualcomm, MediaTek, Samsung, HiSilicon, and more.

The Amaoe UG2-20 V2.0 is a high-precision 20-piece stainless steel stencil kit designed for CPU BGA reballing. This global edition includes templates for a wide range of mobile processors used in modern smartphones. It’s the perfect choice for micro soldering professionals and repair technicians who require reliable and accurate reballing tools.

Key Features:

• Model: UG2-20 V2.0

• Package Includes: 20 CPU stencils

• Stencil Thickness: 0.12 mm

• Material: Durable stainless steel

• Compatible CPU Series:

  • Apple (APU series)

  • Qualcomm (QSU1–QSU5)

  • MediaTek (MTU1–MTU4)

  • HiSilicon (HIU1–HIU2)

  • Samsung (SMU1–SMU3)

  • Spreadtrum (SCU1–SCU2)

  • MIX series (various global CPUs)

• Application: Logic board repair, CPU BGA reballing

• Design: Laser-cut micro-holes for precision solder ball placement

• Compatible with FUBGA reballing stations and standard platforms