Amaoe CG3-45 – Global BGA Reballing Stencil Kit (45 pcs)

Amaoe CG3-45 – Global BGA Reballing Stencil Kit (45 pcs)

Professional set of 45 stainless steel stencils for BGA reballing. Compatible with Apple, Qualcomm, MediaTek, Samsung, HiSilicon, and other global CPU platforms.

The Amaoe CG3-45 kit is a comprehensive solution designed for technicians and repair centers specializing in motherboard repair. It includes 45 precision laser-cut stencils for reballing various CPU, memory, and IC chips found in smartphones and tablets.

Key Features:

• Kit Includes: 45 stencil sheets

• Compatible Chipsets:

  • Apple: UIP1–UIP12 (A8 to A18 series)

  • Qualcomm: QSD1–QSD12

  • MediaTek: MTK1–MTK9

  • HiSilicon: HISI1–HISI6

  • Samsung: SMG1–SMG5

  • Universal Stencil: UNI1

• Stencil Thickness: 0.12mm – ideal for precise solder ball application

• Material: High-quality stainless steel

• Cutting Technology: Laser-cut for superior precision

• Application: Reballing CPU, NAND, baseband, and memory ICs