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Amaoe U-SMG2 – 0.12mm BGA Reballing...

Amaoe U-SMG2 – 0.12mm BGA Reballing Stencil for Exynos

Amaoe
2591464
zł40.00
VAT included

Amaoe U-SMG2 – 0.12mm BGA Reballing Stencil for Exynos 9610/9611/7885/7904/7884/7870/7880

High-precision stainless steel stencil designed for BGA reballing of Samsung Exynos CPU and RAM chips. Ideal for logic board repair professionals.

Amaoe U-SMG2 – 0.12mm BGA Reballing Stencil for Exynos 9610/9611/7885/7904/7884/7870/7880

High-precision stainless steel stencil designed for BGA reballing of Samsung Exynos CPU and RAM chips. Ideal for logic board repair professionals.

The Amaoe U-SMG2 stencil is crafted for microsoldering and reballing work on a wide range of Samsung Exynos processors and memory modules. Laser-cut for accuracy and made from durable stainless steel, it ensures long-lasting performance in repair environments.

Key Features:

  • Model: Amaoe U-SMG2

  • Thickness: 0.12 mm

  • Compatible Chips:

    • Exynos 9610 / 9611 / 7885 / 7904 / 7884 / 7870 / 7880

    • RAM modules for Exynos

    • Other ICs: BCM43456, D5328, SHANNON0937, S2MU005X03, MU106X01-5, S925D2, etc.

  • Material: Stainless steel

  • Cutting Technique: Precision laser-cut

  • Use Case: CPU and IC chip BGA reballing in smartphones and tablets

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