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Amaoe U-SMG1 – 0.12mm BGA Reballing...

Amaoe U-SMG1 – 0.12mm BGA Reballing Stencil for Exynos 8895 / 7570 / 7580 / 3475

Amaoe
2591465
zł40.00
VAT included

Amaoe U-SMG1 – 0.12mm BGA Reballing Stencil for Exynos 8895 / 7570 / 7580 / 3475

High-precision stainless steel stencil designed for professional reballing of Samsung Exynos chips and related components.

Amaoe U-SMG1 – 0.12mm BGA Reballing Stencil for Exynos 8895 / 7570 / 7580 / 3475

High-precision stainless steel stencil designed for professional reballing of Samsung Exynos chips and related components.

The Amaoe U-SMG1 stencil is crafted for technicians and repair professionals who demand precision in BGA soldering work. With a 0.12mm thickness and laser-cut openings, it ensures accurate and consistent solder ball placement on ICs.

???? Product Features:

  • Model: U-SMG1

  • Material: High-quality stainless steel

  • Thickness: 0.12 mm

  • Technology: Laser-cut for ultra-high precision

  • Application: CPU, RAM, and component BGA reballing

  • Chip Compatibility:

    • Processors: Exynos 8895, 7570, 7580, 3475

    • Memory: Exynos 8895 RAM

    • Others: MAX77865, QM78038, SHANNON955, BGA221, BGA153, AFEM-9060, VJ51D, CS47L93 and more

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