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Amaoe SAM:8 – 0.12mm BGA Reballing...

Amaoe SAM:8 – 0.12mm BGA Reballing Stencil for Samsung Note 4 Series

Amaoe
2591466
zł18.00
VAT included

Amaoe SAM:8 – 0.12mm BGA Reballing Stencil for Samsung Note 4 Series

The Amaoe SAM:8 stencil is a professional-grade reballing tool designed specifically for Samsung Note 4 series devices and Qualcomm APQ8084 chipsets. Made of ultra-durable stainless steel, this stencil features a 0.12mm precision thickness, ensuring accuracy and consistent solder ball placement.

Amaoe SAM:8 – 0.12mm BGA Reballing Stencil for Samsung Note 4 Series

The Amaoe SAM:8 stencil is a professional-grade reballing tool designed specifically for Samsung Note 4 series devices and Qualcomm APQ8084 chipsets. Made of ultra-durable stainless steel, this stencil features a 0.12mm precision thickness, ensuring accuracy and consistent solder ball placement.

???? Key Features:

  • Model: SAM:8

  • Thickness: 0.12mm

  • Material: Superhard stainless steel

  • Technology: Precision laser cutting

  • Compatibility:

    • Samsung Note 4 series

    • Qualcomm APQ8084

    • BGA529 CPU

    • Universal EMCP packages

  • Applications: Ideal for BGA reballing of CPUs and memory chips in mobile repair

Whether you're replacing damaged ICs or rebuilding connections on mobile logic boards, this stencil delivers professional results with minimal effort.

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