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Sito Amaoe U-SMG3 – Szablon BGA 0.12...

Sito Amaoe U-SMG3 – Szablon BGA 0.12 mm do Exynos9820 / 9810 / 850 / 3830

Amaoe
2591467
zł40.00
VAT included

Amaoe U-SMG3 – BGA Reballing Stencil 0.12mm for Exynos9820 / 9810 / 850 / 3830

The Amaoe U-SMG3 is a high-precision reballing stencil designed specifically for repairing Samsung Exynos series chips including the 9820, 9810, 850, 3830, and RAM 556. Made from durable stainless steel with a thickness of 0.12mm, it offers excellent heat resistance and reusability – perfect for professional microsoldering tasks

The Amaoe U-SMG3 is a high-precision reballing stencil designed specifically for repairing Samsung Exynos series chips including the 9820, 9810, 850, 3830, and RAM 556. Made from durable stainless steel with a thickness of 0.12mm, it offers excellent heat resistance and reusability – perfect for professional microsoldering tasks.

Product Features:

  • Model: U-SMG3

  • Thickness: 0.12mm

  • Material: High-quality stainless steel

  • Manufacturing: Laser-cut for high precision

  • Purpose: Reballing BGA chips on Samsung smartphones

Compatibility:

  • Exynos 9820

  • Exynos 9810

  • Exynos 850

  • Exynos 3830

  • RAM 556

  • Other ICs indicated on the stencil layout

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