Sito Amaoe U-SMG4 – Szablon do Reballingu BGA 0.12mm dla Exynos880 / 980 / 1080 / 1280 / E8825
AmaoeAmaoe U-SMG4 – BGA Reballing Stencil 0.12mm for Exynos880 / 980 / 1080 / 1280 / E8825
The Amaoe U-SMG4 reballing stencil is designed for precision microsoldering and BGA chip repair on various Samsung Exynos processors. Made of durable stainless steel and laser-cut for accuracy, it ensures consistent performance and alignment when reballing components like Exynos880, 980, 1080, and others
Amaoe U-SMG4 – BGA Reballing Stencil 0.12mm for Exynos880 / 980 / 1080 / 1280 / E8825
The Amaoe U-SMG4 reballing stencil is designed for precision microsoldering and BGA chip repair on various Samsung Exynos processors. Made of durable stainless steel and laser-cut for accuracy, it ensures consistent performance and alignment when reballing components like Exynos880, 980, 1080, and others.
Product Features:
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Model: U-SMG4
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Material: High-grade stainless steel
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Thickness: 0.12mm
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Precision: Laser-cut for tight tolerances
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Type: Universal UBGA stencil for Samsung ICs
Compatible Chips Include:
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Main ICs: Exynos880, Exynos980, Exynos1080, Exynos1280, E8825
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Memory & RAM: RAM 556
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Additional ICs: SHANNON5511, S2MU106X01, SPU13, BGA254, SHANNON5510, QPA5580 and more
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