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Sito Amaoe U-SMG4 – Szablon do...

Sito Amaoe U-SMG4 – Szablon do Reballingu BGA 0.12mm dla Exynos880 / 980 / 1080 / 1280 / E8825

Amaoe
2591468
zł40.00
VAT included

Amaoe U-SMG4 – BGA Reballing Stencil 0.12mm for Exynos880 / 980 / 1080 / 1280 / E8825

The Amaoe U-SMG4 reballing stencil is designed for precision microsoldering and BGA chip repair on various Samsung Exynos processors. Made of durable stainless steel and laser-cut for accuracy, it ensures consistent performance and alignment when reballing components like Exynos880, 980, 1080, and others

Amaoe U-SMG4 – BGA Reballing Stencil 0.12mm for Exynos880 / 980 / 1080 / 1280 / E8825

The Amaoe U-SMG4 reballing stencil is designed for precision microsoldering and BGA chip repair on various Samsung Exynos processors. Made of durable stainless steel and laser-cut for accuracy, it ensures consistent performance and alignment when reballing components like Exynos880, 980, 1080, and others.

Product Features:

  • Model: U-SMG4

  • Material: High-grade stainless steel

  • Thickness: 0.12mm

  • Precision: Laser-cut for tight tolerances

  • Type: Universal UBGA stencil for Samsung ICs

Compatible Chips Include:

  • Main ICs: Exynos880, Exynos980, Exynos1080, Exynos1280, E8825

  • Memory & RAM: RAM 556

  • Additional ICs: SHANNON5511, S2MU106X01, SPU13, BGA254, SHANNON5510, QPA5580 and more

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