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Mijing Soldering Braid 2mm...

Mijing Soldering Braid 2mm... 2

Lutowanie i Reballing

Mijing Soldering Braid 2mm (5 psc)

zł36.00

Braid specifications: Specially adapted flux formula. Tin absorption capacity increased by 60%. Antioxidant formula. No residue, easy to clean. Model 2020: Length: 2.0 m, Width: 2.0 mm. Model 2015: Length: 1.5 m, Width: 2.0 mm.

Sieve for BGA Amaoe iPhone 6S/6SP-A9 T-0.12mm

Lutowanie i Reballing

Sieve for BGA Amaoe iPhone 6S/6SP-A9 T-0.12mm

zł35.00

Sieve for BGA Amaoe iPhone 6S/6SP-A9 T-0.12mm.

Sieve for BGA Amaoe iPhone 6/6P-A8 T-0.12mm

Lutowanie i Reballing

Sieve for BGA Amaoe iPhone 6/6P-A8 T-0.12mm

zł35.00

Sieve for BGA Amaoe iPhone 6/6P-A8 T-0.12mm.

Sieve for BGA Amaoe iPhone 11/Pro/max - A13 T:0.12mm

Lutowanie i Reballing

Sieve for BGA Amaoe iPhone 11/Pro/max - A13 T:0.12mm

zł35.00

Sieve for BGA Amaoe iPhone 11/Pro/max - A13 T:0.12mm.

Sieve for BGA Amaoe iPhone iPhone 7/7P - A10 T:0.12mm

Lutowanie i Reballing

Sieve for BGA Amaoe iPhone iPhone 7/7P - A10 T:0.12mm

zł35.00

Sieve for BGA Amaoe iPhone iPhone 7/7P - A10 T:0.12mm.

Sieve for BGA Amaoe iPhone iPhone XS/XS Max/XR - A13 T:0.12mm

Lutowanie i Reballing

Sieve for BGA Amaoe iPhone XS/XS Max/XR - A13 T:0.12mm

zł35.00

Sieve for BGA Amaoe iPhone iPhone XS/XS Max/XR - A13 T:0.12mm.

Sieve for BGA Amaoe iPhone...

Lutowanie i Reballing

Sieve for BGA Amaoe iPhone 12/Pro/Max/12mini - A14 T:0.12mm

zł35.00

Sieve for BGA Amaoe iPhone iPhone 12/Pro/Max/12mini - A14 T:0.12mm.

Sieve for BGA Amaoe iPhone iPhone 13/Pro/Max/13mini - A15 T:0.12mm

Lutowanie i Reballing

Sieve for BGA Amaoe iPhone 13/Pro/Max/13mini - A15 T:0.12mm

zł35.00

Sieve for BGA Amaoe iPhone iPhone 13/Pro/Max/13mini - A15 T:0.12mm.

Sieve for BGA Amaoe iPhone X/8P/8-1A11 T:0.12mm

Lutowanie i Reballing

Sieve for BGA Amaoe iPhone X/8P/8-1A11 T:0.12mm

zł35.00

Sieve for BGA Amaoe iPhone X/8P/8-1A11 T:0.12mm.

Amaoe M40 Double Sided...

Amaoe M40 Double Sided... 2

Tools

Amaoe M40 Double Sided Grindstone Tweezers Correction Polish Station

zł39.00

FixZone Precision Straight Tweezer. Tools allow you to grasp small items for easy servicing.

Amaoe U-QSD11 0.12MM...

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Amaoe U-QSD11 0.12MM Reballing Stencil – Snapdragon Gen2/Gen3/8s (SM8550, SM8650, SM8635)

zł40.00

Amaoe U-QSD11 0.12MM Reballing Stencil – Snapdragon Gen2/Gen3/8s (SM8550, SM8650, SM8635) Professional BGA reballing stencil by Amaoe – model U-QSD11 – designed for precise motherboard repair of mobile devices. Compatible with the latest Qualcomm Snapdragon chips, perfect for CPU, RAM, and PMIC soldering work.

Amaoe U-QSU6 0.12MM BGA...

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Amaoe U-QSU6 0.12MM BGA Reballing Stencil – Snapdragon Gen3/Gen2/Gen1 (SM8750, SM8650,...

zł40.00

Amaoe U-QSU6 0.12MM BGA Reballing Stencil – Snapdragon Gen3/Gen2/Gen1 (SM8750, SM8650, SM8635, SM7635, SM6450, SM4450, SM7550) The Amaoe U-QSU6 is a high-precision BGA reballing stencil designed for advanced repair work on mobile device motherboards. It supports the latest Qualcomm Snapdragon chipsets and various related components.

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