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Lutowanie i Reballing

Sieve for BGA Amaoe Samsung A10-A70 Sam:14

zł35.00

Sieve for BGA Amaoe Samsung A10-A70 Sam:14. Sieves for processors with the signature: Exynos: 7870 7884 7885 7904 9610 9611 Models: A10-A70 (A105, A202, A305, A405, A505, A515, A530, A600, A750).

Lutowanie i Reballing

Mijing Soldering Braid 2mm (5 psc)

zł36.00

Braid specifications: Specially adapted flux formula. Tin absorption capacity increased by 60%. Antioxidant formula. No residue, easy to clean. Model 2020: Length: 2.0 m, Width: 2.0 mm. Model 2015: Length: 1.5 m, Width: 2.0 mm.

Original displays

LCD iPhone 6 Reg - White

01100084

zł38.00

High-quality display for iPhone 6 in white. It has a speaker holder. Display tested before shipping by our technicians.

Lutowanie i Reballing

Sieve for BGA Amaoe iPhone 6S/6SP-A9 T-0.12mm

240904

zł35.00

Sieve for BGA Amaoe iPhone 6S/6SP-A9 T-0.12mm.

Lutowanie i Reballing

Sieve for BGA Amaoe iPhone 6/6P-A8 T-0.12mm

240900

zł35.00

Sieve for BGA Amaoe iPhone 6/6P-A8 T-0.12mm.

Lutowanie i Reballing

Sieve for BGA Amaoe iPhone 11/Pro/max - A13 T:0.12mm

240920

zł35.00

Sieve for BGA Amaoe iPhone 11/Pro/max - A13 T:0.12mm.

Lutowanie i Reballing

Sieve for BGA Amaoe iPhone iPhone 7/7P - A10 T:0.12mm

240919

zł35.00

Sieve for BGA Amaoe iPhone iPhone 7/7P - A10 T:0.12mm.

Sieve for BGA Amaoe iPhone iPhone XS/XS Max/XR - A13 T:0.12mm

Lutowanie i Reballing

Sieve for BGA Amaoe iPhone XS/XS Max/XR - A13 T:0.12mm

240921

zł35.00

Sieve for BGA Amaoe iPhone iPhone XS/XS Max/XR - A13 T:0.12mm.

Lutowanie i Reballing

Sieve for BGA Amaoe iPhone 12/Pro/Max/12mini - A14 T:0.12mm

240918

zł35.00

Sieve for BGA Amaoe iPhone iPhone 12/Pro/Max/12mini - A14 T:0.12mm.

Sieve for BGA Amaoe iPhone iPhone 13/Pro/Max/13mini - A15 T:0.12mm

Lutowanie i Reballing

Sieve for BGA Amaoe iPhone 13/Pro/Max/13mini - A15 T:0.12mm

240917

zł35.00

Sieve for BGA Amaoe iPhone iPhone 13/Pro/Max/13mini - A15 T:0.12mm.

Lutowanie i Reballing

Sieve for BGA Amaoe iPhone X/8P/8-1A11 T:0.12mm

240916

zł35.00

Sieve for BGA Amaoe iPhone X/8P/8-1A11 T:0.12mm.

Tools

Amaoe M40 Double Sided Grindstone Tweezers Correction Polish Station

2591286

zł39.00

FixZone Precision Straight Tweezer. Tools allow you to grasp small items for easy servicing.

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Amaoe U-QSD11 0.12MM Reballing Stencil – Snapdragon Gen2/Gen3/8s (SM8550, SM8650, SM8635)

2591482

zł40.00

Amaoe U-QSD11 0.12MM Reballing Stencil – Snapdragon Gen2/Gen3/8s (SM8550, SM8650, SM8635) Professional BGA reballing stencil by Amaoe – model U-QSD11 – designed for precise motherboard repair of mobile devices. Compatible with the latest Qualcomm Snapdragon chips, perfect for CPU, RAM, and PMIC soldering work.

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Amaoe U-QSU6 0.12MM BGA Reballing Stencil – Snapdragon Gen3/Gen2/Gen1 (SM8750, SM8650,...

2591481

zł40.00

Amaoe U-QSU6 0.12MM BGA Reballing Stencil – Snapdragon Gen3/Gen2/Gen1 (SM8750, SM8650, SM8635, SM7635, SM6450, SM4450, SM7550) The Amaoe U-QSU6 is a high-precision BGA reballing stencil designed for advanced repair work on mobile device motherboards. It supports the latest Qualcomm Snapdragon chipsets and various related components.

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Amaoe U-QSD12 BGA Reballing Stencil 0.12MM – SM7635 / SM7550 / SM6450 / SM4450 /...

2591480

zł40.00

Amaoe U-QSD12 BGA Reballing Stencil 0.12MM – SM7635 / SM7550 / SM6450 / SM4450 / Snapdragon Gen3/Gen2/Gen1 The Amaoe U-QSD12 is a high-precision reballing stencil designed for professional repair of modern mobile devices. It is ideal for reballing Qualcomm Snapdragon chips including Gen3, Gen2, Gen1, as well as SM7635, SM7550, SM6450, and SM4450.

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Amaoe U-IP12 BGA Stencil 0.12MM – for A18 / A18 Pro / iPhone 16 Series

2591479

zł40.00

Amaoe U-IP12 BGA Stencil 0.12MM – for A18 / A18 Pro / iPhone 16 Series The Amaoe U-IP12 is a high-precision BGA stencil crafted for professionals working with iPhone 16, iPhone 16 Plus, Pro, Pro Max, and e-series logic boards. Designed for reballing A18 and A18 Pro CPU chips, this 0.12mm stencil ensures stable operation, precise alignment, and...

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Amaoe BGA Stencil U-APU9 0.10MM – For A18/A17/A16 CPU and RAM

2591478

zł40.00

Amaoe BGA Stencil U-APU9 0.10MM – For A18/A17/A16 CPU and RAM Professional BGA stencil designed for precise reballing of Apple A-series CPUs and RAM, including A16, A17, A18, and A18 Pro. Made from high-hardness stainless steel, this stencil ensures perfect alignment, durability, and resistance to heat during soldering tasks.

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Amaoe U-IP13 Reballing Stencil 0.12MM for iPhone 17, A19, A19 Pro

2591477

zł40.00

Amaoe U-IP13 Reballing Stencil 0.12MM for iPhone 17, A19, A19 Pro Professional BGA stencil designed for precision reballing of Apple A19 and A19 Pro chipsets, compatible with iPhone 17/Pro/Pro Max/Air series. Crafted from high-quality stainless steel, it ensures accurate soldering and long-lasting durability, ideal for professional microsoldering.

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BGA Reballing Stencil for iPad M3 – 0.12MM | Amaoe Superhard Series

2591476

zł40.00

BGA Reballing Stencil for iPad M3 – 0.12MM | Amaoe Superhard Series High-precision reballing stencil designed for iPad M3 chipsets. Ideal for professional technicians working on CPU, RAM, and EMCP soldering. The Superhard series ensures durability and heat resistance during repeated use.

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iPad M4 BGA Reballing Stencil – 0.12MM | Amaoe Superhard Series

2591475

zł40.00

iPad M4 BGA Reballing Stencil – 0.12MM | Amaoe Superhard Series Professional-grade reballing stencil designed specifically for the iPad M4 series. Manufactured with high-precision stainless steel, this 0.12mm stencil provides superior durability and clean soldering results, ideal for repairing CPU, EMMC, and other IC components.

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Galaxy Tab S9+ 0.20MM BGA Stencil – Amaoe

2591474

zł40.00

Galaxy Tab S9+ 0.20MM BGA Stencil – AmaoeProfessional BGA reballing stencil designed for repairing the Samsung Galaxy Tab S9+. Made from high-quality stainless steel with a thickness of 0.20mm, it ensures precise solder ball positioning and reliable performance during IC repairs.

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Amaoe U-QSU5 – BGA Reballing Stencil 0.12mm for Qualcomm Snapdragon CPUs

2591473

zł40.00

Amaoe U-QSU5 – BGA Reballing Stencil 0.12mm for Qualcomm Snapdragon CPUs The Amaoe U-QSU5 BGA stencil is a professional-grade tool designed for precise reballing of Qualcomm Snapdragon processors. Made from high-quality stainless steel with a 0.12mm thickness, it ensures accurate solder ball placement and stable performance during rework.

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Amaoe U-SMU3 – 0.12mm BGA Stencil for Samsung Exynos CPU Chips

2591472

zł40.00

Amaoe U-SMU3 – 0.12mm BGA Stencil for Samsung Exynos CPU Chips The Amaoe U-SMU3 is a high-quality BGA stencil made of ultra-durable stainless steel, precisely designed for reballing Samsung Exynos CPU series chips. With 0.12mm thickness and excellent heat resistance, it is a perfect choice for advanced technicians and GSM service centers.

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Amaoe U-SMU2 – 0.12mm BGA Stencil for Samsung Exynos CPUs

2591471

zł40.00

Amaoe U-SMU2 – 0.12mm BGA Stencil for Samsung Exynos CPUs The Amaoe U-SMU2 is a high-precision 0.12mm BGA reballing stencil made from durable stainless steel, designed specifically for Samsung Exynos CPU chipsets. It is ideal for professional repair technicians looking for accurate and efficient reballing tools.