New products

New products

Showing 1-36 of 44 item(s)

Amaoe U-QSD11 0.12MM...

New

Home

Amaoe U-QSD11 0.12MM Reballing Stencil – Snapdragon Gen2/Gen3/8s (SM8550, SM8650, SM8635)

zł40.00

Amaoe U-QSD11 0.12MM Reballing Stencil – Snapdragon Gen2/Gen3/8s (SM8550, SM8650, SM8635) Professional BGA reballing stencil by Amaoe – model U-QSD11 – designed for precise motherboard repair of mobile devices. Compatible with the latest Qualcomm Snapdragon chips, perfect for CPU, RAM, and PMIC soldering work.

Amaoe U-QSU6 0.12MM BGA...

New

Home

Amaoe U-QSU6 0.12MM BGA Reballing Stencil – Snapdragon Gen3/Gen2/Gen1 (SM8750, SM8650,...

zł40.00

Amaoe U-QSU6 0.12MM BGA Reballing Stencil – Snapdragon Gen3/Gen2/Gen1 (SM8750, SM8650, SM8635, SM7635, SM6450, SM4450, SM7550) The Amaoe U-QSU6 is a high-precision BGA reballing stencil designed for advanced repair work on mobile device motherboards. It supports the latest Qualcomm Snapdragon chipsets and various related components.

Amaoe U-QSD12 BGA Reballing...

New

Home

Amaoe U-QSD12 BGA Reballing Stencil 0.12MM – SM7635 / SM7550 / SM6450 / SM4450 /...

zł40.00

Amaoe U-QSD12 BGA Reballing Stencil 0.12MM – SM7635 / SM7550 / SM6450 / SM4450 / Snapdragon Gen3/Gen2/Gen1 The Amaoe U-QSD12 is a high-precision reballing stencil designed for professional repair of modern mobile devices. It is ideal for reballing Qualcomm Snapdragon chips including Gen3, Gen2, Gen1, as well as SM7635, SM7550, SM6450, and SM4450.

Amaoe U-IP12 BGA Stencil...

New

Home

Amaoe U-IP12 BGA Stencil 0.12MM – for A18 / A18 Pro / iPhone 16 Series

zł40.00

Amaoe U-IP12 BGA Stencil 0.12MM – for A18 / A18 Pro / iPhone 16 Series The Amaoe U-IP12 is a high-precision BGA stencil crafted for professionals working with iPhone 16, iPhone 16 Plus, Pro, Pro Max, and e-series logic boards. Designed for reballing A18 and A18 Pro CPU chips, this 0.12mm stencil ensures stable operation, precise alignment, and...

Amaoe BGA Stencil U-APU9...

New

Home

Amaoe BGA Stencil U-APU9 0.10MM – For A18/A17/A16 CPU and RAM

zł40.00

Amaoe BGA Stencil U-APU9 0.10MM – For A18/A17/A16 CPU and RAM Professional BGA stencil designed for precise reballing of Apple A-series CPUs and RAM, including A16, A17, A18, and A18 Pro. Made from high-hardness stainless steel, this stencil ensures perfect alignment, durability, and resistance to heat during soldering tasks.

Amaoe U-IP13 Reballing...

New

Home

Amaoe U-IP13 Reballing Stencil 0.12MM for iPhone 17, A19, A19 Pro

zł40.00

Amaoe U-IP13 Reballing Stencil 0.12MM for iPhone 17, A19, A19 Pro Professional BGA stencil designed for precision reballing of Apple A19 and A19 Pro chipsets, compatible with iPhone 17/Pro/Pro Max/Air series. Crafted from high-quality stainless steel, it ensures accurate soldering and long-lasting durability, ideal for professional microsoldering.

BGA Reballing Stencil for...

New

Home

BGA Reballing Stencil for iPad M3 – 0.12MM | Amaoe Superhard Series

zł40.00

BGA Reballing Stencil for iPad M3 – 0.12MM | Amaoe Superhard Series High-precision reballing stencil designed for iPad M3 chipsets. Ideal for professional technicians working on CPU, RAM, and EMCP soldering. The Superhard series ensures durability and heat resistance during repeated use.

iPad M4 BGA Reballing...

New

Home

iPad M4 BGA Reballing Stencil – 0.12MM | Amaoe Superhard Series

zł40.00

iPad M4 BGA Reballing Stencil – 0.12MM | Amaoe Superhard Series Professional-grade reballing stencil designed specifically for the iPad M4 series. Manufactured with high-precision stainless steel, this 0.12mm stencil provides superior durability and clean soldering results, ideal for repairing CPU, EMMC, and other IC components.

Galaxy Tab S9+ 0.20MM BGA...

New

Home

Galaxy Tab S9+ 0.20MM BGA Stencil – Amaoe

zł40.00

Galaxy Tab S9+ 0.20MM BGA Stencil – AmaoeProfessional BGA reballing stencil designed for repairing the Samsung Galaxy Tab S9+. Made from high-quality stainless steel with a thickness of 0.20mm, it ensures precise solder ball positioning and reliable performance during IC repairs.

Amaoe U-QSU5 – BGA...

New

Home

Amaoe U-QSU5 – BGA Reballing Stencil 0.12mm for Qualcomm Snapdragon CPUs

zł40.00

Amaoe U-QSU5 – BGA Reballing Stencil 0.12mm for Qualcomm Snapdragon CPUs The Amaoe U-QSU5 BGA stencil is a professional-grade tool designed for precise reballing of Qualcomm Snapdragon processors. Made from high-quality stainless steel with a 0.12mm thickness, it ensures accurate solder ball placement and stable performance during rework.

Amaoe U-SMU3 – 0.12mm BGA...

New

Home

Amaoe U-SMU3 – 0.12mm BGA Stencil for Samsung Exynos CPU Chips

zł40.00

Amaoe U-SMU3 – 0.12mm BGA Stencil for Samsung Exynos CPU Chips The Amaoe U-SMU3 is a high-quality BGA stencil made of ultra-durable stainless steel, precisely designed for reballing Samsung Exynos CPU series chips. With 0.12mm thickness and excellent heat resistance, it is a perfect choice for advanced technicians and GSM service centers.

Amaoe U-SMU2 – 0.12mm BGA...

New

Home

Amaoe U-SMU2 – 0.12mm BGA Stencil for Samsung Exynos CPUs

zł40.00

Amaoe U-SMU2 – 0.12mm BGA Stencil for Samsung Exynos CPUs The Amaoe U-SMU2 is a high-precision 0.12mm BGA reballing stencil made from durable stainless steel, designed specifically for Samsung Exynos CPU chipsets. It is ideal for professional repair technicians looking for accurate and efficient reballing tools.

Amaoe U-SMU1 – 0.12mm BGA...

New

Home

Amaoe U-SMU1 – 0.12mm BGA Reballing Stencil for Samsung Exynos CPUs

zł40.00

Amaoe U-SMU1 – 0.12mm BGA Reballing Stencil for Samsung Exynos CPUs The Amaoe U-SMU1 is a professional-grade BGA stencil designed for reballing and repairing Samsung Exynos CPUs. With a thickness of 0.12mm and laser-cut precision, this stencil ensures accurate and consistent solder placement for both technicians and repair experts.

Sito Amaoe U-SMG5 – Szablon...

New

Home

Sito Amaoe U-SMG5 – Szablon BGA 0.12mm do układów Exynos990/2100/2200/E9925

zł40.00

Amaoe U-SMG5 – 0.12mm BGA Reballing Stencil for Exynos990/2100/2200/E9925 The Amaoe U-SMG5 is a precision laser-cut BGA stencil designed for efficient and accurate reballing of Exynos series chips. Made of high-quality stainless steel with a thickness of 0.12mm, it ensures durability and precise alignment during solder ball placement.

Sito Amaoe U-SMG4 – Szablon...

New

Home

Sito Amaoe U-SMG4 – Szablon do Reballingu BGA 0.12mm dla Exynos880 / 980 / 1080 / 1280...

zł40.00

Amaoe U-SMG4 – BGA Reballing Stencil 0.12mm for Exynos880 / 980 / 1080 / 1280 / E8825 The Amaoe U-SMG4 reballing stencil is designed for precision microsoldering and BGA chip repair on various Samsung Exynos processors. Made of durable stainless steel and laser-cut for accuracy, it ensures consistent performance and alignment when reballing components...

Sito Amaoe U-SMG3 – Szablon...

New

Home

Sito Amaoe U-SMG3 – Szablon BGA 0.12 mm do Exynos9820 / 9810 / 850 / 3830

zł40.00

Amaoe U-SMG3 – BGA Reballing Stencil 0.12mm for Exynos9820 / 9810 / 850 / 3830 The Amaoe U-SMG3 is a high-precision reballing stencil designed specifically for repairing Samsung Exynos series chips including the 9820, 9810, 850, 3830, and RAM 556. Made from durable stainless steel with a thickness of 0.12mm, it offers excellent heat resistance and...

Amaoe SAM:8 – 0.12mm BGA...

New

Home

Amaoe SAM:8 – 0.12mm BGA Reballing Stencil for Samsung Note 4 Series

zł18.00

Amaoe SAM:8 – 0.12mm BGA Reballing Stencil for Samsung Note 4 Series The Amaoe SAM:8 stencil is a professional-grade reballing tool designed specifically for Samsung Note 4 series devices and Qualcomm APQ8084 chipsets. Made of ultra-durable stainless steel, this stencil features a 0.12mm precision thickness, ensuring accuracy and consistent solder ball...

Amaoe U-SMG1 – 0.12mm BGA...

New

Home

Amaoe U-SMG1 – 0.12mm BGA Reballing Stencil for Exynos 8895 / 7570 / 7580 / 3475

zł40.00

Amaoe U-SMG1 – 0.12mm BGA Reballing Stencil for Exynos 8895 / 7570 / 7580 / 3475 High-precision stainless steel stencil designed for professional reballing of Samsung Exynos chips and related components.

Amaoe U-SMG2 – 0.12mm BGA...

New

Home

Amaoe U-SMG2 – 0.12mm BGA Reballing Stencil for Exynos

zł40.00

Amaoe U-SMG2 – 0.12mm BGA Reballing Stencil for Exynos 9610/9611/7885/7904/7884/7870/7880High-precision stainless steel stencil designed for BGA reballing of Samsung Exynos CPU and RAM chips. Ideal for logic board repair professionals.

Amaoe CG3-45 – Global BGA...

New

Home

Amaoe CG3-45 – Global BGA Reballing Stencil Kit (45 pcs)

zł489.00

Amaoe CG3-45 – Global BGA Reballing Stencil Kit (45 pcs) Professional set of 45 stainless steel stencils for BGA reballing. Compatible with Apple, Qualcomm, MediaTek, Samsung, HiSilicon, and other global CPU platforms.

Amaoe UG2-20 V2.0 – Global...

New

Home

Amaoe UG2-20 V2.0 – Global CPU BGA Reballing Stencil Set (20 pcs)

zł236.00

Amaoe UG2-20 V2.0 – Global CPU BGA Reballing Stencil Set (20 pcs) Professional universal stencil kit for reballing various smartphone CPU chips. Compatible with processors from Apple, Qualcomm, MediaTek, Samsung, HiSilicon, and more.

Amaoe IP16P/16PM-012 – BGA...

New

Out-of-Stock

Home

Amaoe IP16P/16PM-012 – BGA Reballing Stencil 0.12mm for iPhone 16 Pro/ 16 Pro Max...

zł40.00

View

Amaoe IPIP16P/16PM-012 – BGA Reballing Stencil 0.12mm for iPhone 16 Pro/ 16 Pro Max (Middle Layer) High-precision reballing stencil designed for iPhone iPhone 16 Pro/ 16 Pro Max motherboard middle layer repairs. Ideal for professional BGA microsoldering applications.

Amaoe IP16/ 16Pl-012 – BGA...

New

Home

Amaoe IP16/ 16Pl-012 – BGA Reballing Stencil 0.12mm for iPhone 16/ 16 Plus (Middle Layer)

zł40.00

Amaoe IPiPhone 16/ 16 Plus-012 – BGA Reballing Stencil 0.12mm for iPhone 16/ 16 Plus (Middle Layer)High-precision reballing stencil designed for iPhone iPhone 16/ 16 Plus motherboard middle layer repairs. Ideal for professional BGA microsoldering applications.

Amaoe IP17-012 – BGA...

New

Home

Amaoe IP17-012 – BGA Reballing Stencil 0.12mm for iPhone 17 (Middle Layer)

zł40.00

Amaoe IP17-012 – BGA Reballing Stencil 0.12mm for iPhone 17 (Middle Layer) High-precision reballing stencil designed for iPhone 17 motherboard middle layer repairs. Ideal for professional BGA microsoldering applications.

Lanrui U8S Alloy Piercing &...

Lanrui U8S Alloy Piercing &... 2

New

Home

Lanrui U8S Alloy Piercing & Sliding Drill Bit with Handle – for Stripped Screw Removal

zł40.00

Lanrui U8S Alloy Piercing & Sliding Drill Bit with Handle – for Stripped Screw Removal High-precision tool for effortlessly removing stripped or damaged screws – ideal for electronics repair, fine mechanics, and DIY use.

JC Non-removal Face ID Flex...

New

Tools

JC Non-removal Face ID Flex Cable – for iPhone 16 Pro

zł135.00

Professional flex cable for iPone 16 Pro Face ID without removing original sensors – safe, solder-free, and fully compatible with JCID tools.

JC Non-removal Face ID Flex...

New

Tools

JC Non-removal Face ID Flex Cable – for iPhone 16/ 16 Plus

zł135.00

Professional flex cable for iPone 16 / 16 Plus Face ID without removing original sensors – safe, solder-free, and fully compatible with JCID tools.

JC Non-removal Face ID Flex...

New

Tools

JC Non-removal Face ID Flex Cable – for iPhone 15 Pro Max

zł86.00

Professional flex cable for iPone 15 Pro Max Face ID without removing original sensors – safe, solder-free, and fully compatible with JCID tools.

JC Non-removal Face ID Flex...

New

Tools

JC Non-removal Face ID Flex Cable – for iPhone 15 Pro

zł86.00

Professional flex cable for iPone 15 Pro Face ID without removing original sensors – safe, solder-free, and fully compatible with JCID tools.

JC Non-removal Face ID Flex...

New

Tools

JC Non-removal Face ID Flex Cable – for iPhone 15/ 15 Plus

zł86.00

Professional flex cable for iPone 15 / 15 Plus Face ID without removing original sensors – safe, solder-free, and fully compatible with JCID tools.

JC Non-removal Face ID Flex...

New

Tools

JC Non-removal Face ID Flex Cable – for iPhone 14 Pro Max

zł76.00

Professional flex cable for iPone 14 Pro Max Face ID without removing original sensors – safe, solder-free, and fully compatible with JCID tools.

JC Non-removal Face ID Flex...

New

Tools

JC Non-removal Face ID Flex Cable – for iPhone 14 Pro

zł76.00

Professional flex cable for iPone 14 Pro Face ID without removing original sensors – safe, solder-free, and fully compatible with JCID tools.

JC Non-removal Face ID Flex...

New

Tools

JC Non-removal Face ID Flex Cable – for iPhone 14 Plus

zł76.00

Professional flex cable for iPone 14 Plus Face ID without removing original sensors – safe, solder-free, and fully compatible with JCID tools.

JC Non-removal Face ID Flex...

New

Tools

JC Non-removal Face ID Flex Cable – for iPhone 14

zł76.00

Professional flex cable for iPone 14 Face ID without removing original sensors – safe, solder-free, and fully compatible with JCID tools.

JC Non-removal Face ID Flex...

New

Tools

JC Non-removal Face ID Flex Cable – for iPhone 13 Pro Max

zł65.00

Professional flex cable for iPone 13 Pro Max Face ID without removing original sensors – safe, solder-free, and fully compatible with JCID tools.

JC Non-removal Face ID Flex...

New

Tools

JC Non-removal Face ID Flex Cable – for iPhone 13 Pro

zł65.00

Professional flex cable for iPone 13 mini / 13 repairing Face ID without removing original sensors – safe, solder-free, and fully compatible with JCID tools.

1
2

Home